Microfluidic chip fabrication using hot embossing and thermal bonding of COP

Type
article
Resource
B.Y. Pemg, C.W. Wu, Y.K Shen, Y. Lin(2010).Microfluidic chip fabrication using hot embossing and thermal bonding of COP. Polymers for Advanced Technologies.(21):457-466.
Date Issued
2010
Author(s)
Pemg, B.Y.;Wu, C.W.;Shen, Y.K;Lin, Y.
Subjects
牙體技術學系
期刊論文
URI

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