Novel Multilayered Ti/TiN Barrier for Al Metallization

Type
article
Resource
JOURNAL OF ELECTRONIC MATERIALS.(34):1150-1156.
Date Issued
2005
Author(s)
歐耿良
Wu WF; Tsai KC; Chao CG; Chen JC; Ou KL;
Subjects
生醫材料暨組織工程研究所
期刊論文
URI
File(s)
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0 B

Format

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Checksum

(MD5):d41d8cd98f00b204e9800998ecf8427e

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