Effect of temperature and flux concentration on soldering of base metal.

Type

article

Resource

J Oral Rehabil.(27):1047-1053.

Date Issued

2000

Author(s)

Lee; S.Y.; Lin; C.T.; Wang; M.H.; Tseng; H.; Huang; H.M.; Dong; D.R.; Pan; L.C.

Subjects

生醫材料暨組織工程研究所

期刊論文

URI

https://203.71.86.71/handle/123456789/27749

File(s)

Name

attachment.pdf

Size

35.61 KB

Format

Adobe PDF

Checksum

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