Effect of Nitrogen Plasma Treatments on Tantalum Diffusion Barriers in Copper Metallization

Type
article
Resource
JOURNAL OF THE ELECTROCHEMICAL SOCIETY.(150):G83-.
Date Issued
2003
Author(s)
歐耿良
Wu WF; Ou KL; Chou CP; Wu CC
Subjects
生醫材料暨組織工程研究所
期刊論文
URI
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(MD5):8c209768755b4b4add95d1a2ec61836a

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