Comparative study of polycrystalline Ti, amorphous Ti, and multi-amorphous Ti as a diffusion barrier for Cu metallization

Type
article
Resource
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B.(23):229-235.
Date Issued
2005
Author(s)
歐耿良
Ou KL; Yu MS; Hsu RQ; Lin MH
Subjects
生醫材料暨組織工程研究所
期刊論文
URI

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