Improved TaN Barrier Layer Against Cu Diffusion by Formation of an Amorphous Layer Using Plasma Treatment

Type

article

Resource

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B.(20):2154-.

Date Issued

2002

Author(s)

歐耿良

Ou KL; Wu WF; Chou CP; Wu CC

Subjects

生醫材料暨組織工程研究所

期刊論文

URI

https://203.71.86.71/handle/123456789/27780

File(s)

Name

attachment.pdf

Size

34.41 KB

Format

Adobe PDF

Checksum

(MD5):2e826c86955c302b93d5361def9526c9