北醫大醫學工程學院楊正昌教授研究，獲得107年度科技部「智慧仿生材料與數位設計平臺」專案4年期計畫，補助金額達2,800萬元

Type
newspaper
Date Issued
2019-06
Author(s)
醫學工程學院
Subjects
北醫出版品
今日北醫
URI
File(s)
No Thumbnail Available
Name

20190609.pdf

Size

464.12 KB

Format

Adobe PDF

Checksum

(MD5):471efea2947a2f16baf8494a96ab3040

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