Resin Flow Characteristic of Underfill Process on Flip Chip Encapsulation

Type

article

Resource

International Communications in Heat and Mass Transfer.(31):1075-1084.

Date Issued

2004

Author(s)

Shen YK; Ju CM; Shie YJ; Chein HW

Subjects

牙體技術學系

期刊論文

URI

https://203.71.86.71/handle/123456789/29511

File(s)

Name

attachment.pdf

Size

33.38 KB

Format

Adobe PDF

Checksum

(MD5):2f62c05c9b468477482738dc7669a556