Pemg, B.Y.;Wu, C.W.;Shen, Y.K;Lin, Y.B.Y.;Wu, C.W.;Shen, Y.K;Lin, Y.Pemg2026-05-222026-05-222010https://203.71.86.71/handle/123456789/29545牙體技術學系期刊論文Microfluidic chip fabrication using hot embossing and thermal bonding of COParticle