黃豪銘Liu; C.L.; Kao; H.C.; Lo; W.H.; Huang; H.M.2026-05-222026-05-221995https://203.71.86.71/handle/123456789/28216en-US生醫材料暨組織工程研究所期刊論文Bonding Characteristic of CD Spinal Instrumentation Componentarticle