潘力誠Pan L.C.HuangH.M.LinC.T.Shih, Y.H.Y.H.ShihLee, S.Y.S.Y.Lee2026-06-062026-06-062001https://203.71.86.71/handle/123456789/51162en-US通識教育中心期刊論文Acoustic emissions during soldering of base metals and the resultant structures and strengths.article