潘力誠; 黃豪銘; 林哲堂; 施永勳; 鄭信忠; 曲國田; 李勝揚Li-Chern Pan; Haw-Ming Huang; Che-Tong Lin; Yung-Hsun Shih; Hsin-Chung Cheng; Kuo-Tien Chu; Sheng-Yang Lee2026-05-212026-05-212001https://203.71.86.71/handle/123456789/24775en-US牙醫學系期刊論文Acoustic emissions during soldering of base metals and the resultant structures and strengthsarticle