黃豪銘Pan; L.C.; Lin C.T.; Wang; M.H.; Huang; H.M.; Lee; S.Y.2026-05-222026-05-222000https://203.71.86.71/handle/123456789/28201en-US生醫材料暨組織工程研究所期刊論文Acoustic emission- A noninvasive technique in the assessment of dental solderingarticle