黃豪銘Lee; S.Y.; Lin; C.T.; Wang; M.H.; Tseng; H.; Huang; H.M.; Dong; D.R.; Pan; L.C.2026-05-222026-05-222000https://203.71.86.71/handle/123456789/27749en-US生醫材料暨組織工程研究所期刊論文Effect of temperature and flux concentration on soldering of base metal.article