歐耿良Wu WF; Ou KL; Chou CP; Wu CC2026-05-222026-05-222003https://203.71.86.71/handle/123456789/27747en-US生醫材料暨組織工程研究所期刊論文Effect of Nitrogen Plasma Treatments on Tantalum Diffusion Barriers in Copper Metallizationarticle