歐耿良Ou KL; Yu MS; Hsu RQ; Lin MH2026-05-222026-05-222005https://203.71.86.71/handle/123456789/28230en-US生醫材料暨組織工程研究所期刊論文Comparative study of polycrystalline Ti, amorphous Ti, and multi-amorphous Ti as a diffusion barrier for Cu metallizationarticle