歐耿良Ou KL; Wu WF; Chou CP; Wu CC2026-05-222026-05-222002https://203.71.86.71/handle/123456789/27780en-US生醫材料暨組織工程研究所期刊論文Improved TaN Barrier Layer Against Cu Diffusion by Formation of an Amorphous Layer Using Plasma Treatmentarticle