歐耿良Yeh YM; Chen CS; Tsai MH; Shyng YC; Lee SY; Ou KL2026-05-222026-05-222005https://203.71.86.71/handle/123456789/27748en-US生醫材料暨組織工程研究所期刊論文Effect of Pulse-Reverse Current on the Microstructure and Properties of Electroformed Nickel-Iron Mold Insertarticle