黃豪銘Lee; S.Y.; Lin; C.T.; Chiang; H.C.; Huang; H.M.; Shih; Y.H.; Chen; H.C.; Dong; D.R.; Pan; L.C.2026-05-222026-05-222001https://203.71.86.71/handle/123456789/27862en-US生醫材料暨組織工程研究所期刊論文Thermo-debonding mechanisms in dentin bonding systems using finite element analysis.article