許明照2026-05-242026-05-242003https://203.71.86.71/handle/123456789/34476123148 bytes137661618 bytes45056 bytes140837 bytes521931 bytesapplication/pdfapplication/postscriptapplication/mswordapplication/pdfapplication/postscripten-US生藥學研究所計畫報告Development of Novel Thermal Granulation and Application Study (I)新穎性熱融黏造粒法之開發與應用研究(I)report