許明照2026-05-242026-05-242004https://203.71.86.71/handle/123456789/3447734107 bytes3096520 bytes45056 bytes140856 bytes523002 bytesapplication/pdfapplication/postscriptapplication/mswordapplication/pdfapplication/postscripten-US生藥學研究所計畫報告Development of Novel Thermal Granulation and Application Study (II)新穎性熱融黏造粒法之開發與應用研究(II)report