李勝揚;林哲堂Lee S-Y; Lin C-T; Wang M-H; Tseng H; Huang H-M; Dong D-R and Pan L-C2026-05-212026-05-212000https://203.71.86.71/handle/123456789/24810en-US牙醫學系期刊論文Effect of temperature and flux concentration on soldering of base metal.article